Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.
Solus Advanced Materials is the only copper foil manufacturer in Europe, and we steadily enhance our competitiveness in the global market based on 60 years’ of manufacturing experience and know-how.
Solus Advanced Materials supplies high-end copper foil based on foundation technique of ultra thin foil and coating.
Copper foil is used in various electronic equipment, and the core technology is to make the surface smooth and thin.
Solus Advanced Materials is the only copper foil manufacturer in Europe, and we steadily enhance our competitiveness in the global market based on 60 years’ of manufacturing experience and know-how.
Product name | Products by Application Type | Characteristic |
---|---|---|
TZA | Conventional multilayer laminate | Enhanced high temperature elogation |
TZA-B | Middle and low loss signal application | Reverse treatment type and low roughness |
TWS | High Tg and engineering plastic laminate | High bonding strength at BT resin base prepreg |
TWLS | Very low Dk laminate | High bonding strength at low Dk prepreg |
SR-TZA-B-FX | Flexible application | High flexural ductility property with low roughness |
BF-TZA-FX | Flexible application | Flexural ductility property and high bonding strength with PI film |
LPT-YE | Smart Card / Tape Carrier Substrate | Superior elastic modulus and high mechanical property |
Doublethin™ | IC packaging and Advanced HDI for the fine patterning | Very thin foil (minimum 1.5um) with carrier foil |
BF-HFZ | Ultra high-Frequency application | Good bonding strength with fluoropolymer resin system and low roughness |
BF-TZA & BF-HFI-LP2 | High speed digital application | Good bonding strength with very low loss laminate and very low roughness |
BF-ANP | Ultra high speed digital application | Almost free profile with good bonding strength |